Nā Huahana Kōkua Uhi ʻoki

Nā ʻano hana: 0.01um ʻO ka pololei o ka hoʻihoʻi ʻana o ka 0.01um slit die head jumper joint i loko o 1 micron

0.02um ʻO ka hoʻomanawanui holo ʻana o ka ʻōwili hope o ke uhi he 2μm, a ʻo ka pololei he 0.002μm/m.

0.002um/m ʻO ke kū pololei o ka lehelehe poʻo make ʻoki he 0.002μm/m

Nā kikoʻī huahana

Nā ʻano hana: 0.01um ʻO ka pololei o ka hoʻihoʻi ʻana o ka 0.01um slit die head jumper joint i loko o 1 micron

0.02um ʻO ka hoʻomanawanui holo ʻana o ka ʻōwili hope o ke uhi he 2μm, a ʻo ka pololei he 0.002μm/m.

0.002um/m ʻO ke kū pololei o ka lehelehe poʻo make ʻoki he 0.002μm/m.

Pae Noi：

ʻO ka uhi photoresist semiconductor, ka uhi dielectric, a me ka uhi ʻiliʻili i ka ʻoihana uila

ʻO ka uhi ʻana o nā mea electrode maikaʻi a maikaʻi ʻole a me ka uhi ʻana o ka electrode pila ma ka ʻoihana ikehu hou

Nā ʻano hana:

Hoʻokele ʻia ka hewa o ka mānoanoa o ka uhi ʻana i loko o ± 3um

nā wili hoʻonohonoho maikaʻi no ka hoʻoponopono maʻalahi

papa hoʻokaʻawale kahe, me ke kū'ē haʻahaʻa o ka puka ea, ka wikiwiki like o ka makani, a me ka pololei a hiki i ka 98%

Pae Noi：

Ka hoʻomaloʻo ʻana a me ka hoʻomaloʻo ʻana i nā papa kaapuni uila (PCB) a me nā hōʻikeʻike aniani wai (LCD/TFT)

Ka hoʻomaʻemaʻe aniani (LCD), ka hoʻomaʻemaʻe ultrasonic, ka hoʻohemo wai, a me ka hoʻomaloʻo ʻana

Ke puhi nei ka ea wela i ka ʻoihana lole

Nā ʻano hana:

Ka hoʻomanawanui ʻana o ke ʻano ≤0.002mm

Ka hoʻomanawanui Coaxiality ≤0.002mm

ʻO ka ʻili ʻili Ra≤0.05um

Pae Noi：

ʻO ka uhi ʻiliʻili pale no nā hōʻikeʻike kelepona/papa a me ka uhi ʻana i nā mea electrode no nā pila lithium i ka ʻoihana uila.

ʻUhi ʻili pale no nā kino kaʻa

Hana ʻana i nā huahana photovoltaic no nā pila perovskite a me nā pūnaewele solar i hoʻonaninani ʻia i ka dye.

Ma mua: PE1800 Hoʻopaʻa wela i loko o ka mold Co-extrusion Die Head

Aʻe: Nā Huahana Kōkua Mold

E kākau i kāu leka ma aneʻi a hoʻouna mai iā mākou