Nā Huahana Hoʻohui Hoʻopili Slit Coating

ʻO ka wehewehe pōkole:

Nā hiʻohiʻona hana: 0.01um ʻO ka hoʻihoʻi pololei ʻana o ka 0.01um slit die head jumper joint i loko o 1 micron

0.02um ʻO 2μm ka hoʻomanawanui holo ʻana o ka wili hope, a ʻo 0.002μm / m ka pololei.

0.002um/m ʻO ka pololei o ka lehelehe poʻo make he 0.002μm/m


Huahana Huahana

Huahana Huahana

1

Nā hiʻohiʻona hana: 0.01um ʻO ka hoʻihoʻi pololei ʻana o ka 0.01um slit die head jumper joint i loko o 1 micron

0.02um ʻO 2μm ka hoʻomanawanui holo ʻana o ka wili hope, a ʻo 0.002μm / m ka pololei.

0.002um/m ʻO ka pololei o ka slit make poʻo lehelehe he 0.002μm/m.

Laulā noi:

Semiconductor photoresist coating, dielectric coating, a me ka uhi kiʻiʻoniʻoni ma ka ʻoihana uila

ʻO ka uhi ʻana o nā mea electrode maikaʻi a maikaʻi ʻole a me ka uhi uila uila i ka ʻoihana ikehu hou

2

Nā ʻano hana:

Hoʻomalu ʻia ka hewa mānoanoa o ka uhi ʻana i loko o ± 3um

nā wili hoʻopono no ka hoʻoponopono maʻalahi

ka pā hoʻokaʻawale kahe, me ka haʻahaʻa haʻahaʻa o ka puka makani, ka wikiwiki o ka makani, a me ka pololei a hiki i 98%

Laulā noi:

ʻO ka hoʻomaloʻo ʻana a me ka maloʻo ʻana o nā papa kaapuni uila (PCB) a me nā hōʻike aniani wai (LCD/TFT)

ʻO ka hoʻomaʻemaʻe aniani (LCD), ka hoʻomaʻemaʻe ultrasonic, ka hoʻoheheʻe wai, a me ka maloʻo

E puhi ana ka ea wela i ka ʻoihana lole

3

Nā ʻano hana:

ʻO ka hoʻomanawanui cylindricity ≤0.002mm

Hoʻomanawanui Coaxiality ≤0.002mm

ʻO ka ʻili ʻili Ra≤0.05um

Laulā noi:

ʻO ka uhi kiʻiʻoniʻoni pale no nā hōʻike kelepona / papa a me ka uhi mea electrode no nā pā lithium i ka ʻoihana uila.

ʻO ka uhi kiʻiʻoniʻoni pale no nā kino kaʻa

ʻO ka hana ʻana i nā huahana Photovoltaic no nā ʻokoʻa perovskite a me nā pūniu lā i hoʻopili ʻia.


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